Switching for Semiconductor Test

For IC manufacturers, evolving design scales, shrinking geometry, and the use of new materials are making wafer level reliability testing more critical than ever. This is driving reliability testing and modeling further upstream in the production process to reduce the time, production capacity, money, and material lost if the wafer is defective or the packaged device fails. When faced with the problem of testing higher I/O counts while at the same time reducing costs, many reliability engineers find they cannot solve this using traditional switching solutions. Instead, engineers are increasingly turning toward modular, flexible solutions that can scale to fit their needs. 

Pickering’s modular PXI and LXI matrix switching solutions have been used in many semiconductor test applications, including package level and wafer-level test, shorts/opens, capacitance, I/V test for transient charge trapping and SCPT (Single Charge Pulse Trapping). 

Our matrix switching solutions for semiconductor test feature:

  •  High fidelity connection – Pickering's instrumentation-grade Reed Relays for low path resistance, repeatable connection
  • Multiple Analog Buses – parallel testing to increase throughput
  • High relay closure count – multiple test point connections to Ground for I/V tests
  • The ability to load test sequences into the unit and utilize triggers to transition tests, reducing test time
  • Fast operate time with Pickering Reed Relay based matrices
  • Ease of creating switching routines with tools like our Switch Path Manager signal routing software
  • Modular design for scalability and ease of maintenance  

Take a look at our recent Customer Success Article – 

Opens & Shorts Testing of Semiconductor Packages using Pickering's High-Density LXI Matrix Modules >>

Below are some examples of our Semiconductor Test Modular Matrix Switching Solutions


High-density LXI Reed Relay Matrix
(model 65-221)

LXI switching high-density-lxi-reed-relay-matrix.jpg


  • Modular Matrix Design with 4 Y-Axis Connections
  • User Configurable for X Dimensions by Plug-in addition, up to 6144 Crosspoints
  • Twelve or Six Analog Buses
  • Highest Quality Ruthenium Reed Relays for Maximum Reliability at Low Levels and High Switching Speeds
  • Built-In Scan List Sequence Stores with Triggering Capability
  • Supported by our Diagnostic Test Tools:
    • BIRST™ - Built-In Relay Self-Test
    • eBIRST™ Switching System Test Tools

High-density Single-pole LXI Matrix Modules
(model 60-553 series) 

LXI switching 60-553 high-density LXI Reed Relay matrix

  • Single Pole High-density Matrix with up to 4096 Crosspoints
  • Dual Analog Bus
  • Matrix Size 256x4 to 1024x4
  • Up to 1027 simultaneously closed crosspoints
  • Switch up to 150VDC/100VAC & up to 60W Max Power
  • Maximum Switch Current of 2A
  • Supported by our Diagnostic Test Tools:
    • BIRST - Built-In Relay Self-Test
    • eBIRST Switching System Test Tools

BRIC™ Ultra-high-density PXI Matrix Modules
(model series 40-558)


Pickering's BRIC PXI Ultra-high-density PXI switch matrix modules 

  • Ultra-high-density 0.5A Matrix with up to 6,144 crosspoints per module 
  • Integrated PXI Module with Built-In High Performance Screened Analog Bus
  • Automatic Isolation Relay Switching Maximizes Bandwidth and Matrix Reliability
  • Uses High Reliability Pickering Ruthenium Reed Relays for Maximum Performance
  • Choice ofAnalog Bus Widths: 6, 8, 12 and 16 Pole with Dual Analog Bus Options
  • Available as 2, 4 and 8-Slot 3U PXI Modules
  • Supported by our Diagnostic Test Tools:
    • BIRST - Built-In Relay Self-Test
    • eBIRST Switching System Test Tools

High-density Single-slot PXI Matrix Module
(model 40-584)

PXI High-density single-slot PXI matrix module for Semiconductor test

  • High-density single-slot 3U PXI 2A matrix with 256 crosspoints
  • 128x2, 64x4, 32x8 and 16x16 options
  • Maximum current 2A hot or cold switching
  • Switch up to 300VDC/250VAC and up to 60W max power
  • Uses gold-plated contact Electromechanical Relays
  • Supported by our Diagnostic Test Tools:
    • BIRST - Built-In Relay Self-Test
    • eBIRST Switching System Test Tools

High-density Single-slot PXI Reed Relay Module
(model series 40-54x)

PXI switching

  • Highest Density Single-Slot 3U PXI Reed Relay Matrix Module with 528 Crosspoints
  • Minimize Cost using Partially Populated Configurations - Available for all models
  • Switch up to 150 V, 0.5A with 10W Max Power
  • Fast Operating Speed <300ms
  • Supported by eBIRST Switching System Test Tools


To learn more about our switching solutions for use in Semiconductor Test or any of our other switching, simulation or cabling solutions, please contact us or visit our Worldwide locations page to find your local Pickering Sales Office or Agent.

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