Switching for Semiconductor Test
For IC manufacturers, evolving design scales, shrinking geometry, and the use of new materials are making wafer level reliability testing more critical than ever. This is driving reliability testing and modeling further upstream in the production process to reduce the time, production capacity, money, and material lost if the wafer is defective or the packaged device fails. When faced with the problem of testing higher I/O counts while at the same time reducing costs, many reliability engineers find they cannot solve this using traditional switching solutions. Instead, engineers are increasingly turning toward modular, flexible solutions that can scale to fit their needs.
Pickering’s modular PXI and LXI matrix switching solutions have been used in many semiconductor test applications, including package level and wafer-level test, shorts/opens, capacitance, I/V test for transient charge trapping and SCPT (Single Charge Pulse Trapping).
Our matrix switching solutions for semiconductor test feature:
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Take a look at our recent Customer Success Article –
Below are some examples of our Semiconductor Test Modular Matrix Switching Solutions
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High-density LXI Reed Relay Matrix
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High-density Single-pole LXI Matrix Modules
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BRIC™ Ultra-high-density PXI Matrix Modules
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High-density Single-slot PXI Matrix Module
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High-density Single-slot PXI Reed Relay Module
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To learn more about our switching solutions for use in Semiconductor Test or any of our other switching, simulation or cabling solutions, please contact us or visit our Worldwide locations page to find your local Pickering Sales Office or Agent.
