Modular Breakout System for Hardware-In-Loop Simulation
- Combined Breakout Box feature set with the Flexibility of a Fault Insertion Unit
- Compact, Reliable Design
- Improved Signal Integrity
- Modular Patch Panel Optimized for Fault Insertion
- Hardware-in-the-Loop Simulation
- For Signal Monitoring
- For Signal Injection
- To Automate Faults
Designed to Simplify Hardware-in-the-Loop Simulation Applications
Traditional Hardware-In-the-Loop (HIL) Simulation features signal switching for the purpose of injecting faults into a Unit Under Test (UUT). To make manual measurements and induce a fault manually prior to writing test code, a Breakout Box (BoB) needs to be added. The majority of the BoBs and Fault Insertion Unit (FIU) switch systems available today are not modular and are fixed in configuration, creating a test solution that is not often ideal. In addition, they have cable configurations that are cumbersome and in many cases expensive.
Modular in a Single Unit
Designed in partnership with OPAL-RT Technologies, this Modular Breakout System combines a BoB feature set with the added flexibility of an FIU. By mating the FIU chassis directly to the BoB using our plug-in modules, cabling is minimized, creating a more compact reliable design and improving signal integrity.
As most UUTs have several different signal types and parameters to be tested, the Modular Breakout System’s design means you can specify several different voltage and current options in the same chassis. You get to add just what you need for your test requirements, which can save you money over other designs.
In addition, all cables to the simulation system and the UUT are located behind the front panel of the BoB. This creates a simpler front panel that is less prone to damage.
To learn more about the system or to let us know your exact requirements, contact us and we will get back to your with pricing and delivery.
Choices for FIU and Breakout System Requirements
As the modular design uses PXI, users can take advantage of our large range of FIU switch products. These FIU modules are available in different choices for channel count, fault busses, voltage and current. Multiple modules can be installed in a chassis.
Traditional BoB designs feature a manual potentiometer for creating resistive faults. We can automate this process by adding one of our programmable resistance modules to the Breakout System. The module can be controlled manually through a soft front panel, as well as programmatically—thus speeding up a test process and ensuring repeatability.
If testing needs change, both the Breakout system modules and FIU modules can be added and/or replaced by the user. Our software driver supports our entire FIU range, so no new software is needed to integrate the new modules.
If you don't see what you need, please contact us. We have considerable in-house experience designing custom switch solutions. All module and cabling manufacturing processes are done within our two factories on flexible manufacturing lines allowing us to offer simple customization to meet our customers needs.